ABOUT TSiC

OUR VISION

To be a Regional Market Leader in providing Innovative Engineering Solutions to Semiconductor Industry.

OVERVIEW OF OUR GROUP

TSiC Berhad was incorporated in Malaysia on 19 September 2023 as a private limited company under the Companies Act 2016 and was subsequently converted into a public limited company on 19 June 2024.

The principal activity of the Company is investment holding. Through our wholly owned subsidiary, BPE Synergy Engineering Sdn. Bhd., we are primarily engaged in the repair and replating of electronic and electrical (E&E) products, as well as the provision of engineering strategy & technical solutions consultancy.

We specialize in supporting the semiconductor industry, offering a comprehensive range of services including on-site technical support for IC (Integrated Circuit) manufacturing, printed circuit board (PCB) and mechanical design, fabrication and assembly, system integration, as well as repair, replating, and troubleshooting of PCBs and power supply units for semiconductor. Additionally, we specialize in the global sourcing and supply of critical semiconductor components, including high reliability electronic parts and precision mechanical hardware for IC manufacturing.

Our Group structure

100

TSiC Berhad is a holding company with 100% ownership of BPE Synergy Engineering Sdn Bhd

A snapshot of our business model is as follows: -
Services	Trading
Service contract Semiconductor product optimization engineering and manufacturing support. End to End IC assembly, test engineering and production sustaining. Project Design, development, and assembly of semiconductor test products (probe cards, load boards, test sockets) to support wafer level and final production testing. Design and development of system integration products for IC test applications, and optimization of IC test platforms for high-volume manufacturing including hardware/software co-optimization. Troubleshooting and repair Board sustain restoration Footprint sustain restoration (replating) Burn-in board maintenance Power supply and board troubleshooting Component level troubleshooting	Buying and selling of components and parts

A snapshot of our business model is as follows: -

Services

Trading

Service contract

Semiconductor product optimization engineering and manufacturing support.
End to End IC assembly, test engineering and production sustaining.

Project

Design, development, and assembly of semiconductor test products (probe cards, load boards, test sockets) to support wafer level and final production testing.
Design and development of system integration products for IC test applications, and optimization of IC test platforms for high-volume manufacturing including hardware/software co-optimization.

Troubleshooting and repair

Board sustain restoration
Footprint sustain restoration (replating)
Burn-in board maintenance
Power supply and board troubleshooting
Component level troubleshooting

Buying and selling of components and parts

Do you have a question?
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+606 512 2215

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